NIT Jalandhar

डा बी आर अम्बेडकर राष्ट्रीय प्रौद्योगिकी संस्थान, जालन्धर
Dr B R Ambedkar National Institute of Technology, Jalandhar

FESEM SIGMA 500VP (Field Emission Scanning Electron Microscope with EDS and EBSD Sensors)

Department: Institute Instrumentation Centre
Concerned Person:
Name Office IIC
Operator
Institute Instrumentation Centre
Email ID oiic@nitj.ac.in
Mobile No. 9872317830
Location:

Institute Instrumentation Centre,New Science Block

Available For:

For Both (Internal & External) Users

Performa For Booking:
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Major Specifications:

The SIGMA 500VP Field Emission Scanning Electron Microscope (FE-SEM), equipped with Energy Dispersive X-ray Spectroscopy (EDS) and Electron Backscatter Diffraction (EBSD) sensors, is known for its advanced capabilities in imaging and material analysis. Below are the major specifications for this sophisticated instrument:

SIGMA 500VP FE-SEM Major Specifications

General Specifications:

  • Model: SIGMA 500VP
  • Electron Source: Field Emission Gun (FEG)
  • Vacuum Modes: High vacuum, variable pressure (VP)

Imaging Performance:

  • Resolution:
    • High Vacuum Mode: 1.0 nm at 15 kV, 1.7 nm at 1 kV
    • Variable Pressure Mode: 1.4 nm at 20 kV
  • Magnification: 12x to 2,000,000x (depends on configuration and sample)
  • Accelerating Voltage: 0.02 kV to 30 kV
  • Probe Current: 3 pA to 20 nA

Detectors:

  • Secondary Electron (SE) Detector: Provides high-resolution surface images.
  • Backscattered Electron (BSE) Detector: Enables compositional contrast imaging.
  • In-lens SE Detector: Offers enhanced resolution and surface detail contrast.
  • Variable Pressure SE Detector (VPSE): For imaging in variable pressure mode.

Analytical Capabilities:

  • Energy Dispersive X-ray Spectroscopy (EDS):
    • Elemental Detection Range: From boron (B) to uranium (U)
    • Mapping Capabilities: Elemental mapping and line scan analysis
  • Electron Backscatter Diffraction (EBSD):
    • Crystallographic Analysis: Grain orientation, phase identification, and texture analysis
    • Resolution: Down to nanometer scale for EBSD mapping

Stage and Sample Handling:

  • Stage: 5-axis motorized stage
    • X/Y Travel Range: 100 mm
    • Z Travel Range: 50 mm
    • Tilt: -3° to +70°
    • Rotation: 360° continuous
  • Sample Size: Up to 200 mm diameter (depending on chamber size and configuration)

Software and Data Processing:

  • Control Software: ZEISS SmartSEM
  • EDS Software: Integrated with EDS analysis software for elemental identification and quantification
  • EBSD Software: Integrated with EBSD analysis software for crystallographic analysis

Additional Features:

  • Charge Compensation: Available in VP mode for imaging non-conductive samples
  • Chamber Size: Spacious chamber to accommodate large samples and multiple detectors
  • User Interface: Intuitive interface for ease of use and efficient workflow

These specifications highlight the capabilities of the SIGMA 500VP FE-SEM in providing high-resolution imaging and comprehensive material analysis through EDS and EBSD sensors. This makes it a versatile tool for researchers and engineers in various fields, including materials science, nanotechnology, electronics, and more.

Research Potential:

The SIGMA 500VP Field Emission Scanning Electron Microscope (FE-SEM) with Energy Dispersive X-ray Spectroscopy (EDS) and Electron Backscatter Diffraction (EBSD) sensors offers extensive research potential across a variety of scientific and engineering disciplines. Here are some areas where the SIGMA 500VP can significantly impact research:

Materials Science

  • Nanomaterials: High-resolution imaging and elemental analysis of nanoparticles, nanowires, and other nanostructures to study their properties, synthesis, and applications.
  • Metallurgy: Analysis of metals and alloys to understand grain structure, phase composition, and defects, crucial for developing new materials and improving existing ones.
  • Polymers: Investigating the morphology and composition of polymer blends, composites, and nanocomposites to enhance their mechanical and thermal properties.

Semiconductor and Electronics

  • Failure Analysis: Identifying defects and failures in electronic components and semiconductor devices to improve reliability and performance.
  • Process Development: Characterizing materials and processes in semiconductor manufacturing, including doping, layer deposition, and etching.
  • Nanodevices: Imaging and analysis of nanoscale electronic and optoelectronic devices to optimize their design and functionality.

Life Sciences

  • Biological Samples: Imaging biological specimens such as tissues, cells, and biomaterials to study their structure and composition.
  • Biomineralization: Investigating the formation and composition of biominerals in organisms, which is important for understanding biological processes and developing biomimetic materials.
  • Medical Implants: Analyzing the surface morphology and composition of medical implants to improve biocompatibility and performance.

Geosciences

  • Mineralogy: Identifying and characterizing minerals in geological samples to understand their formation, distribution, and properties.
  • Petrology: Studying the texture and composition of rocks to gain insights into geological processes such as magma crystallization and metamorphism.
  • Paleontology: Examining the microstructure and composition of fossils to understand ancient life forms and environmental conditions.

Environmental Science

  • Pollution Studies: Analyzing particulate matter and other environmental samples to identify sources of pollution and assess their impact on the environment.
  • Soil and Sediment Analysis: Investigating the composition and structure of soils and sediments to understand their properties and interactions with contaminants.
  • Biogeochemistry: Studying the distribution and cycling of elements in the environment to understand biogeochemical processes and their effects on ecosystems.

Forensic Science

  • Trace Evidence Analysis: Examining trace evidence such as glass fragments, gunshot residue, and fibers to support criminal investigations.
  • Toxicology: Analyzing biological samples for toxic elements and compounds to aid in forensic toxicology investigations.
  • Document Examination: Investigating the composition of inks, papers, and other materials used in documents to detect forgeries and alterations.

Industrial Applications

  • Quality Control: Ensuring the quality of materials and products in industries such as aerospace, automotive, and pharmaceuticals by analyzing their composition and structure.
  • Failure Analysis: Investigating the causes of failure in industrial components and systems to improve their design and prevent future failures.
  • Process Optimization: Monitoring and optimizing manufacturing processes by analyzing the materials and products at various stages of production.

Advancements in Analytical Techniques

  • Method Development: Developing new analytical methods and techniques using the advanced capabilities of the SIGMA 500VP to push the boundaries of material analysis.
  • Interdisciplinary Research: Combining imaging and analytical techniques to address complex research questions across multiple disciplines, such as combining materials science with biology or environmental science.

The SIGMA 500VP FE-SEM, with its high-resolution imaging and comprehensive analytical capabilities provided by EDS and EBSD sensors, is a powerful tool for researchers across a wide range of fields. Its versatility and advanced features enable detailed characterization and analysis of materials, leading to new insights and advancements in science and technology.


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Developed by: Computer Centre, Dr. B.R. Ambedkar National Institute of Technology, Jalandhar